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MC74LVX139 Dual 2-to-4 Decoder/ Demultiplexer
The MC74LVX139 is an advanced high speed CMOS 2-to-4 decoder/ demultiplexer fabricated with silicon gate CMOS technology. When the device is enabled (E = low), it can be used for gating or as a data input for demultiplexing operations. When the enable input is held high, all four outputs are fixed high, independent of other inputs. The inputs tolerate voltages up to 7.0 V, allowing the interface of 5.0 V systems to 3.0 V systems.
Features http://onsemi.com MARKING DIAGRAMS
* * * * * * * * * * * *
High Speed: tPD = 6.0 ns (Typ) at VCC = 3.3 V Low Power Dissipation: ICC = 4 m (Max) at TA = 25C High Noise Immunity: VNIH = VNIL = 28% VCC Power Down Protection Provided on Inputs Balanced Propagation Delays Designed for 2 V to 3.6 V Operating Range Low Noise: VOLP = 0.5 V (Max) Pin and Function Compatible with Other Standard Logic Families Latchup Performance Exceeds 300 mA Chip Complexity: 100 FETs or 25 Equivalent Gates ESD Performance: Human Body Model > 2000 V; Machine Model > 200 V Pb-Free Packages are Available*
16 SOIC-16 D SUFFIX CASE 751B 1 LVX139 AWLYWW
16 TSSOP-16 DT SUFFIX CASE 948F 1 LVX 139 ALYW
16 SOEIAJ-16 M SUFFIX CASE 966 1 LVX139 ALYW
A WL or L Y WW or W
= = = =
Assembly Location Wafer Lot Year Work Week
ORDERING INFORMATION
See detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet.
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
(c) Semiconductor Components Industries, LLC, 2005
1
March, 2005 - Rev. 2
Publication Order Number: MC74LVX139/D
MC74LVX139
Ea A0a A1a Y0a Y1a Y2a Y3a GND 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 VCC Eb A0b A1b Y0b Y1b Y2b Y3b E H L L L L
FUNCTION TABLE
Inputs A1 X L L H H A0 X L H L H Y0 H L H H H Outputs Y1 Y2 H H L H H H H H L H Y3 H H H H L
Figure 1. Pin Assignment
ADDRESS INPUTS
A0a A1a
2 3
4 5 6 7
Y0a Y1a Y2a Y3a ACTIVE-LOW OUTPUTS
Ea
1
ADDRESS INPUTS
A0b A1b
14 13
12 11 10 9
Y0b Y1b Y2b Y3b ACTIVE-LOW OUTPUTS
Eb
15
Figure 2. Logic Diagram
En Y0
Y1 A0
Y2
Y3 A1
Figure 3. Expanded Logic Diagram (1/2 of Device)
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MC74LVX139
A1a A0a Ea
3 2 1
X/Y 1 2 EN 0 1 2 3
4 Y0a A1a 3 5 Y1a A0a 2 6 Y2a Ea 1 7 Y3a 12 Y0b 11 Y1b A1b 13 10 Y2b A0b 14 9 Y3b Eb 15
0 1
DMUX 0 0 G 3 1 2 3
4 Y0a 5 Y1a 6 Y2a 7 Y3a 12 Y0b 11 Y1b 10 Y2b 9 Y3b INPUT
A1b 13 A0b 14 Eb 15
Figure 4. IEC Logic Diagram
Figure 5. Input Equivalent Circuit
MAXIMUM RATINGS
Symbol VCC VIN VOUT IIK IOK IOUT ICC PD TSTG VESD Positive DC Supply Voltage Digital Input Voltage DC Output Voltage Input Diode Current Output Diode Current DC Output Current, per Pin DC Supply Current, VCC and GND Pins Power Dissipation in Still Air Storage Temperature Range ESD Withstand Voltage Human Body Model (Note 1) Machine Model (Note 2) Charged Device Model (Note 3) Above VCC and Below GND at 125C (Note 4) SOIC Package TSSOP SOIC Package TSSOP Parameter Value -0.5 to +7.0 -0.5 to +7.0 -0.5 to VCC +0.5 -20 $20 $25 $75 200 180 -65 to +150 >2000 >200 >2000 $300 143 164 Unit V V V mA mA mA mA mW C V
ILATCHU
P
Latchup Performance Thermal Resistance, Junction-to-Ambient
mA C/W
qJA
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. Tested to EIA/JESD22-A114-A 2. Tested to EIA/JESD22-A115-A 3. Tested to JESD22-C101-A 4. Tested to EIA/JESD78
RECOMMENDED OPERATING CONDITIONS
Symbol VCC VIN VOUT TA tr, tf DC Supply Voltage DC Input Voltage DC Output Voltage Operating Temperature Range, all Package Types Input Rise or Fall Time VCC = 5.0 V + 0.5 V Output in 3-State High or Low State Characteristics Min 2.0 0 0 -40 0 Max 3.6 5.5 VCC 85 100 Unit V V V C ns/V
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MC74LVX139
DC CHARACTERISTICS (Voltages Referenced to GND)
VCC Symbol VIH Parameter Minimum High-Level Input Voltage Maximum Low-Level Input Voltage High-Level Output Voltage Low-Level Output Voltage Input Leakage Current Maximum Quiescent Supply Current (per package) IOH = -50 mA IOH = -50 mA IOH = -4 mA IOL = 50 mA IOH = 50 mA IOH = 4 mA VIN = 5.5 V or GND VIN = VCC or GND Condition (V) 2.0 3.0 3.6 2.0 3.0 3.6 2.0 3.0 3.0 2.0 3.0 3.0 0 to 3.6 3.6 Min 0.75 VCC 0.7 VCC 0.7 VCC - - - 1.9 2.9 2.58 - - - - 1.0 TA = 25C Typ - - - - - - 2.0 3.0 3.0 0.0 Max - - - 0.25 VCC 0.3 VCC 0.3 VCC - - - 0.1 0.1 0.36 0.1 2.0 -40C TA 85C Min 0.75 VCC 0.7 VCC 0.7 VCC - - - 1.9 2.9 2.48 - - - - - Max - - - 0.25 VCC 0.3 VCC 0.3 VCC - - - 0.1 0.1 0.44 1.0 - Unit V
VIL
V
VOH
V
VOL
V
IIN ICC
- 1.0
mA mA
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II II III I II III I I I I I III I I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I III I I I I I I II III I II III I I II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII III I I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II III I II III II III I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I III I I I I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II III III I I I I I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II III I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I III I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
AC ELECTRICAL CHARACTERISTICS Input tr = tf = 3.0 ns
Symbol tPLH, tPHL Parameter Test Conditions TA = 25C Typ -40C TA 85C Min 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 - Max Min - - - - - - - - - Max Unit ns Maximum Propagation Delay, A to Y VCC = 2.7 V CL = 15 pF CL = 50 pF CL = 15 pF CL = 50 pF CL = 15 pF CL = 50 pF CL = 15 pF CL = 50 pF 8.5 11.0 6.0 8.5 15.0 16.5 10.0 13.0 13.0 16.5 17.8 18.0 12.0 15.0 15.5 18.0 10.0 15.0 10 VCC = 3.3 V 0.3 V VCC = 2.7 V tPLH, tPHL Maximum Propagation Delay, E to Y 8.0 10.0 5.5 7.5 4 ns VCC = 3.3 V 0.3 V 8.2 13.0 10 CIN Maximum Input Capacitance pF Typical @ 25C, VCC = 3.3 V 26 CPD Power Dissipation Capacitance (Note 5) pF 5. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC/2 (per decoder). CPD is used to determine the no-load dynamic power consumption; PD = CPD VCC2 fin + ICC VCC. A tPLH Y 50% VCC VCC 50% GND tPHL Y E VCC 50% tPHL 50% VCC tPLH GND
Figure 6. Switching Waveform
Figure 7. Switching Waveform
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MC74LVX139
TEST POINT OUTPUT DEVICE UNDER TEST
CL *
*Includes all probe and jig capacitance
Figure 8. Test Circuit ORDERING INFORMATION
Device MC74LVX139DR2 MC74LVX139DR2G MC74LVX139DTR2 MC74LVX139M MC74LVX139MG MC74LVX139MEL MC74LVX139MELG Package SOIC-16 SOIC-16 (Pb-Free) TSSOP-16* SOEIAJ-16 SOEIAJ-16 (Pb-Free) SOEIAJ-16 SOEIAJ-16 (Pb-Free) Shipping 2500 Tape & Reel 2500 Tape & Reel 2500 Tape & Reel 50 Units / Rail 50 Units / Rail 2000 Tape & Reel 2000 Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *This package is inherently Pb-Free.
EMBOSSED CARRIER DIMENSIONS (See Notes 6 and 7)
Tape Size
8 mm
B1 Max
4.35 mm (0.179")
D
1.5 mm + 0.1 -0.0 (0.059" ( 0 004 +0.004 -0.0)
D1
1.0 mm Min (0.179") 1.5 mm Min (0.060)
E
1.75 mm 0.1 (0.069 0.004") )
F
3.5 mm 0.5 (1.38 0.002") 5.5 mm 0.5 (0.217 0.002")
K
2.4 mm Max (0.094") 6.4 mm Max (0.252")
P
4.0 mm 0.10 (0.157 0.004") 4.0 mm 0.10 (0.157 0.004") 8.0 mm 0.10 (0.315 0.004") 4.0 mm 0.10 (0.157 0.004") 8.0 mm 0.10 (0.315 0.004") 12.0 mm 0.10 (0.472 0.004") 16.0 mm 0.10 (0.63 0.004")
P0
4.0 mm 0.1 (0.157 0.004") )
P2
2.0 mm 0.1 (0.079 0.004") )
R
25 mm (0.98")
T
0.6 mm (0.024)
W
8.3 mm (0.327)
12 mm
8.2 mm (0.323")
30 mm (1.18")
12.0 mm 0.3 (0.470 0.012")
16 mm
12.1 mm (0.476")
7.5 mm 0.10 (0.295 0.004")
7.9 mm Max (0.311")
16.3 mm (0.642)
24 mm
20.1 mm (0.791")
11.5 mm 0.10 (0.453 0.004")
11.9 mm Max (0.468")
24.3 mm (0.957)
6. Metric Dimensions Govern-English are in parentheses for reference only. 7. A0, B0, and K0 are determined by component size. The clearance between the components and the cavity must be within 0.05 mm min to 0.50 mm max. The component cannot rotate more than 10 within the determined cavity
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MC74LVX139
PACKAGE DIMENSIONS
SOIC-16 D SUFFIX CASE 751B-05 ISSUE J
-A-
16 9 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. DIM A B C D F G J K M P R MILLIMETERS MIN MAX 9.80 10.00 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.19 0.25 0.10 0.25 0_ 7_ 5.80 6.20 0.25 0.50 INCHES MIN MAX 0.386 0.393 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0_ 7_ 0.229 0.244 0.010 0.019
-B-
1 8
P
8 PL
0.25 (0.010)
M
B
S
G F
K C -T-
SEATING PLANE
R
X 45 _
M D
16 PL M
J
0.25 (0.010)
TB
S
A
S
TSSOP-16 DT SUFFIX CASE 948F-01 ISSUE A
16X K REF NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH. PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE -W-. MILLIMETERS MIN MAX 4.90 5.10 4.30 4.50 --- 1.20 0.05 0.15 0.50 0.75 0.65 BSC 0.18 0.28 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0_ 8_ INCHES MIN MAX 0.193 0.200 0.169 0.177 --- 0.047 0.002 0.006 0.020 0.030 0.026 BSC 0.007 0.011 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0_ 8_
0.10 (0.004) 0.15 (0.006) T U
S
M
TU
S
V
S
K K1
16
2X
L/2
9
J1 B -U-
L
PIN 1 IDENT. 1 8
J
N 0.15 (0.006) T U
S
0.25 (0.010) M
A -V- N F DETAIL E
C 0.10 (0.004) -T- SEATING
PLANE
H D G
DETAIL E
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EEE CCC EEE CCC
SECTION N-N
-W-
DIM A B C D F G H J J1 K K1 L M
MC74LVX139
SOEIAJ-16 M SUFFIX CASE 966-01 ISSUE O
16
9
LE Q1 E HE M_ L DETAIL P
1
8
Z D e A VIEW P
c
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 5. THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE 0.46 ( 0.018). DIM A A1 b c D E e HE L LE M Q1 Z MILLIMETERS MIN MAX --- 2.05 0.05 0.20 0.35 0.50 0.18 0.27 9.90 10.50 5.10 5.45 1.27 BSC 7.40 8.20 0.50 0.85 1.10 1.50 10 _ 0_ 0.70 0.90 --- 0.78 INCHES MIN MAX --- 0.081 0.002 0.008 0.014 0.020 0.007 0.011 0.390 0.413 0.201 0.215 0.050 BSC 0.291 0.323 0.020 0.033 0.043 0.059 10 _ 0_ 0.028 0.035 --- 0.031
b 0.13 (0.005)
M
A1 0.10 (0.004)
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MC74LVX139
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MC74LVX139/D

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